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"Mechanical Issues for Flexible Electronics" Flex Workshop,
Leoben, Austria, April 10-11, 2014

    

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Scope

Innovation and market demand are driving the design and manufacturing of flexible devices for applications in medicine, entertainment, and sensor technologies. However, with the combination of so many different materials with differing mechanical behavior and length scales, flexible electronics are still not yet a reality for everyone. Issues that arise include, for example, the deposition process, resulting microstructures, and adhesion of the thin film materials to the substrates that are used to develop flexible devices. This workshop will focus on these issues as well as other thin film topics related to the mechanical behavior of flexible and stretchable electronic devices.

  • Thin film deposition techniques for polymer substrates

  • Microstructure – processing – property relationships of thin films

  • Fracture, deformation, fatigue, and delamination of films and interfaces

  • Novel techniques  to measure thin films properties (mechanical, electrical, optical, etc)

The workshop is organized within the framework of GDRi MECANO will take place on April 10-11th, 2014, being hosted by the Department of Material Physics, Montuniversität Leoben, and the Erich Schmid Institute of Materials Science, Leoben, Austria.

The goal of the workshop will be to encourage an open discussion and collaboration efforts between the various groups in Europe working the field of flexible electronics. It will also be an opportunity to for PhDs and Post-docs to present their results to a focused group of researchers.

 

 


                   
 
GDRi Coordinator : Olivier Thomas (IM2NP, Aix-Marseille University)
Co-coordinators : Anne Ponchet (CEMES, CNRS, Toulouse) and T. Pardoen (Université Catholique Louvain, Belgium)