 | Joseph Romen Cubillo |
| IM2NP - Polytech Dpt Microélectronique et Télécommunications 38, rue Frédéric Joliot-Curie IMT Technopôle de Château Gombert 13451 Marseille Cedex 20 France | |
| téléphone : +33 (0) 4 92 72 57 49 | |
| mail : romen.cubillo@im2np.fr |
Postdoc (Université d'Aix-Marseille)
Domaine d'activité : IC Packaging
[1] J.R Cubillo, R. Brouard, T.D Silva “ Chirp analyzer using heterodyne detection for 10 Gbps optical transmitter ”, Optical Fiber Communications OFC, Anaheim/Los Angeles USA, technical session, 2001.
[2] J.R Cubillo, “ 3 Golden rules for high speed PCB design”, Ansoft 2005 HFSS users workshop, San Diego USA, 2005.
[3] “PCB (Test fixture)/Chip carrier (test vehicle)/DIE (surrogate test DIE) broadband RF analysis”, Leading Insight Ansoft poster sessions, Paris France, 2006
[4] J.R Cubillo, J.Gaubert, S.Bourdel, H.Barthélémy, P. Pannier, “ A simple filtering approach to improve the return loss of a PCB to Die transition trough a PBGA package for over GHz applications”,IEEE SPI proceedings on “ signal propagation on interconnects”, Geneoa, Italy may 2007.
[5] J.R. Cubillo, M. Egels, J. Gaubert, M. Battista, S. Bourdel, P. Pannier, H. Barthélémy, “ Codesigning LNA IC and package for UWB applications in the 6-8,5 GHz ECC UWB band”, UWB Radio Technology Workshop/IET 2007 symposium on UWB, Grenoble May 2007.
[6] J.R. Cubillo, J. Gaubert, S.Bourdel, H. Barthélémy, M. Battista, M. Egels “ Ultra Wide Band Pass filter embedding a MLF low cost package with wire bond attach process”,IEEE International Conference on Electronics Circuit and Systems ICECS, Marrakech, Maroc, 2007.
[7] J.R Cubillo, J. Gaubert, S. Bourdel, H. Barhélémy, “ Characterization test plan for a PCB to DIE transition in a fcBGA application”,IEEE International Conference on Electronics Circuit and Systems ICECS, Marrakech, Maroc, 2007.
[8] J.R. Cubillo, J. Gaubert, S.Bourdel, “Using Die to chip carrier wire bond transition to build a 4th order differential LP filter for 10 Gpbs O/E receiver”,IEEE SPI proceedings on “ signal propagation on interconnects”,Avigon, France may 2008.
[9] J.R. Cubillo, J. Gaubert, S.Bourdel “Optimizing coplanar wave guide to microstripline transition with the help of the low pass filter theory in the mm wave domain”,IEEE Electronic System-Integration Technology Conference, London, UK , sept 2008.
[10] J.R. Cubillo, J. Gaubert, S.Bourdel, H. Barthélémy “RF Low-Pass Design Guiding Rules to Improve PCB to Die Transition Applied to Different Types of Low-Cost Packages”, IEEE transaction on Advanced packaging CPMT,Aug. 2008, vol.31, issue 3, page 526-535.
[11] O. Fourquin, J.R. Cubillo, J. Gaubert, S.Bourdel, M. Battista “Design method for carrier to Die transition for UWB system in package”, Colloque national du Groupement De Recherche system on chip –system in package CNRS, Paris, France, Juin 2008.
[12] O. Fourquin, J.R. Cubillo, J. Gaubert, S.Bourdel, M. Battista “Enhanced Wire Bond Transition from Die to Chip Carrier for 3.1-10.6 GHz UWB applications”,IEEE Electrical Design of Advanced Packaging and Systems EDAPS symposium 2008, Seoul, South Korea, Dec 2008.
