médaille de bronze CNRS 2003

Dominique Mangelinck
IM2NP
Faculté des Sciences et Techniques
Avenue Escadrille Normandie Niemen
Case 142
13397 Marseille Cedex 20
France
téléphone : + 33 (0) 4 91 28 89 86
fax : +33 (0) 4 91 28 87 75
mail :dominique.mangelinck@im2np.fr


Directeur de recherche CNRS


Domaines d'activité :

Nouveaux matériaux pour la microélectronique - Siliciures - Réactivité interfaciale


Publications récentes :

Chi D.Z., Mangelinck D., Dai J.Y., Lahiri S.K.- DLTS characterization of electrically active defects in n-Si induced by rapid thermal annealing Ni(Pt) silicidation.- Applied Physics Letters, vol. 73, p. 3385-, 2000

Lee P.S., Mangelinck D., Dai J.Y., Osipowicz T., Pey K.L., Ding J., Ho C.S.- On the Ni-Si phase transformation with/without native oxide.- Microelectronic Engineering, vol. 51-52, p. 583-594, 2000

Lee P.S., Mangelinck D., Pey K.L., Ding J., Osipowicz T., Ho C.S., Chen G.L., Chan L.- Characterization of Ni- and Ni(Pt)-silicide formation on narrow polycrystalline Si lines by Raman spectroscopy.- in "Nondestructive Methods for Materials Characterization", T. Matikas, N. Meyendorf, G. Baaklini, R. Gilmore (eds), Material Research Society Symposia Proceedings, vol. 591, p. 269-, 2000

Lee P.S., Mangelinck D., Pey K.L., Shen Z.X., Ding J., Osipowicz T., See A.- Micro-Raman spectroscopy investigation of nickel silicides and nickel (platinum) silicides.- Electrochemical and Solid State Letters, vol. 3, p. 153-, 2000

Lee P.S., Pey K.L., Mangelinck D., Ding J., Wee A.S.T., Chan L.- Improved NiSi salicide process using presilicide N2+ implant for MOSFETs.- IEEE Electron Devices Letters, vol. 21, p. 566-, 2000

Chi D.Z., Mangelinck D., Lahiri S.K., Lee P.S., Pey K.L.- A comparative study of current-voltage characteristics of Ni- and Ni(Pt)-silicided p+/n diodes.- Applied Physics Letters, vol. 78, p. 3256-, 2001

Chi D.Z., Mangelinck D., Zuruzi A.S., Wong A.S.W., Lahiri S.K.- Nickel silicide as a contact material for submicron CMOS devices.- Journal of Electronic Materials, vol. 30, p. 1483-1488, 2001

Lee P.S., Mangelinck D., Lahiri S.K., Pey K.L., Ding J., Chi D.Z., Dai J.Y., See A.- Ni silicide formation on Si(100) and poly-Si with a presilicide N implantation.- Journal of Electronic Materials, .- vol. 30, p. 1554-1559, 2001

Lee P.S., Pey K.L., Mangelinck D., Ding J., Wee A.S.T., Chan L.- New salicidation technology with Ni(Pt) alloy for MOSFETs.- IEEE Electron Devices Letters, vol. 22, p. 568-, 2001

Seng H.L., Osipowitcz T., Lee P.S., Mangelinck D., Sum T.C., Watt F.- Micro-RBS study of nickel silicide formation.- Nuclear Instruments and Methods in Physics Research. Section B, Beam Interactions with Materials and Atoms, vol.181, p. 399-, 2001

Gas P., Girardeaux C., Mangelinck D., Portavoce A.- Reaction and diffusion at interfaces of micro and nano structured materials.- Material Science and Engineering B, acceptée, 2002

Jarmar T., Seger J., Ericson F., Mangelinck D., Smith U. and Zhang S.L.- Morphological and phase stability of nickel germanosilicide on Si1-xGex under thermal stress.- Journal of Applied Physics, vol. 92, p. 7193-, 2002

Lee P.S., Mangelinck D., Pey K.L., Ding J., Chi D.Z., Dai J.Y., See A.- Enhanced stability of Ni monosilicide on MOSFETs poly-Si gate stack.- Microelectronic Engineering, vol. 60, p. 171-, 2002

Lee P.S., Pey K.L., Mangelinck D., Ding J., Chi D. Z., Dai J.Y., Chan L.- Phase and layer stability of Ni- and Ni(Pt)- silicides on narrow poly-Si lines.- Journal of the Electrochemical Society, vol. 149, p. G331-, 2002

Lee P.S., Pey K.L., Mangelinck D., Ding J., Osipowicz T., See A.- Layer inversion of Ni(Pt)Si on mixed phase Si films.- Electrochemical and Solid State Letters, vol. 5, p. G15-, 2002

Seger J., Zhang S.L., Mangelinck D. and Radamson H. H.- Increased nucleation temperature of NiSi2 in the reaction of Ni thin films with Si1-xGex.- Applied Physics Letters, vol. 81, p. 1978-, 2002

Gas P., Girardeaux C., Mangelinck D., Portavoce A. - Reaction and diffusion at interfaces of micro and nanostructured materials. - Material Science and Engineering B, vol. 101, p. 43-, 2003

Lee P.S., Pey K.L., Mangelinck D., Ding J., Chan L. - In situ XRD analysis of Ni(Pt)/Si(100) reactions in low temperature regime < 400 degrees C. - Solid State Communications, vol. 128, n° 9-10, p. 325-328, 2003

Mangelinck D., Gas P., T. Badeche T., Taing E., Nemouchi F., Perrin-Pellegrino C., Niel S., Mirabel J.-M., Farez L., Albarede P.H. - Formation of C49-TiSi2 in flash memories : a nucleation controlled phenomenon ? - Microelectronics Engineering, vol. 70, p. 220-, 2003

Bergman C., Gas p., Mangelinck D.- Nanoscale effects on interfacial reactions.- Journal of the Electroanalytical Chemistry, vol. 573, n° 1, p. 71-75, 2004

Drillet P., Pazsko F., Mangelinck D., Gas P., Clugnet G., Bergman C., Dulcy C. Vaughan G.- Real time synchrotron analysis of the initial stages of galvaannealing in Al containing Zn baths.- Proceedings of the 6th International Conference on Zinc and Zinc Alloy Coated Steel Sheet, (Galvatech'04), Association for Iron § Steel Technology (ed.), 186 Thorn Hill Road, Warrendale, PA 15086, p. 667-, 2004

Mangelinck D., Lee P.S., Osipowitcz T., Pey K.L.- Analysis of laterally non-uniform layers and sub-micron devices by Rutherford backscattering spectrometry.- Nuclear Instruments and Methods in Physics Research B, vol. 215, n° 3-4, p. 495-500, 2004

Pey K.L., Lee P.S. and Mangelinck D.- Ni(Pt) alloy silicidation on (100) Si and poly-silicon lines.- Thin Solid Films, vol. 462-463, p. 137-145, 2004

Drillet P, Dulcy C, Pazsko F, Mangelinck D., Gas P., Clugnet G., Bergman C., Vaughan G.- Real time synchrotron analysis of the initial stages of the galvanization process in Al containing Zn baths.- Revue de Métallurgie, Cahiers d’Informations Techniques, vol. 102, n° 1, p. 75-78, 2005

Lee P.S., Pey K.L., Mangelinck D., Chi D.Z., Osipowicz T.- On the morphological changes of Ni- and Ni(Pt)-silicides.- Journal of the Electrochemical Society, vol. 152, n° 4, p. G305-G308, 2005

Nemouchi F., Mangelinck D. Bergman C., Gas P.- Differential scanning calorimetry analysis of the linear parabolic growth of nanometric Ni silicide thin films on a Si substrate.- Applied Physics Letters, vol. 86, p. 041903-05, 2005

Mangelinck D.- L'effet d'alliage dans les siliciures : mécanismes fondamentaux de croissance et stabilité - applications à la microélectronique.- Habilitation à diriger des recherches, Université d'Aix-Marseille, 11 février 2005

Hoummada K., Cadel E., Mangelinck D., Perrin-Pellegrino C., Blavette D., Deconihout B. First stages of the formation of Ni silicide by atom probe tomography. Applied Physics Letters, vol. 89, n° 18, p. 81905, 2006

Hoummada K., Mangelinck D., Perrin C., Gas P., Carron V., Holliger P., et Ziegler E. Redistribution of arsenic during the reaction of nickel thin films with silicon at relatively high temperature : role of agglomeration. Microelectronics Engineering, vol. 83, n° 11, p. 2264-2267, 2006

Mangelinck D. Effect of a third element on the stability of NiSi thin films on Si. Defect and Diffusion Forum, vol. 249, p. 127-134, 2006

Mangelinck D. Synthèse et stabilité des RDI siliciures/semiconducteurs: approche thermocinétique. 1er Congrès International sur La Basse Dimensionalité et la NanoTechnologie, El Jadida, Maroc, 1-3 Novembre 2006

Cojocaru-Mirédin O., Mangelinck D., Hoummada K., Cadel E., Blavette D., Deconihout B., et Perrin-Pellegrino C. Snowplow effect and reactive diffusion in the Pt doped Ni–Si system. Scripta Materialia, vol 57, 5, p. 373-376, 2007

Hoummada K., Mangelinck D., Cadel E., Perrin-Pellegrino C., Blavette D., et Deconihout B. Formation of Ni silicide at room temperature studied by laser atom probe tomography. Microelectronic Engineering, vol. 84, n° 11, p. 2517-, 2007

Perrin C., Nemouchi F., Clugnet G., et Mangelinck D. Anisotropy of the thermal expansion of the Ni(Si[sub 1 - x]Ge[sub x]) phases investigated by high-temperature x-ray diffraction. Journal of Applied Physics, vol 101, 7, p. 073512, 2007

Portavoce A, Simola R., Mangelinck D., Bernardini J., P.fornara P. Dopant diffusion during amorphous Silicon crystallisation. Diffusion and Defect Data, vol 264,33-38, 2007

Yao H. B, Bouville M, Chi D Z, Sun H P, Pan X Q, Srolovitz D J, Mangelinck D. Interplay between grain boundary grooving, stress, and dealloying in the agglomeration of NiSi1-xGex films. Electrochemical and Solid State Letters, vol. 10, p. H53-H55, 2007

Hoummada K., Mangelinck D., Perrin C., Carron V., et Holliger P. Measurement of the redistribution of arsenic at nickel silicide/silicon interface by secondary ion mass spectrometry: artifact and optimized analysis conditions. Journal of Applied Physics, vol 104, 2, p. 024313, 2008

Hoummada K., Portavoce A., Perrin-Pellegrino C., Mangelinck D., et Bergman C. Differential scanning calorimetry measurements of kinetic factors involved in salicide process. Applied Physics Letters, vol 92, p. 133109, 2008

Mangelinck D., Hoummada K. Effect of stress on the transformation of Ni2Si into NiSi. Applied Physics Letters, vol. 92, 254101, 2008

Mangelinck D., K. Hoummada, O. Cojocaru-Mirédin, E. Cadel, C. Perrin-Pellegrino, D. Blavette. Atom probe tomography of Ni silicides : First stages of reaction and redistribution of Pt. Microelectronic Engineering, vol. 85, n° 10, p. 1995-1999, 2008

 



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