Battista, M., Gaubert, J., Egels, M., Bourdel, S., Barthélemy, H.  High-voltage-Gain CMOS LNA For 6–8.5-GHz UWB Receivers. IEEE Transactions on Circuits and Systems II: Express Briefs,  vol. 55,  n°8, pp. 713 – 717,  2008 http://dx.doi.org/10.1109/TCSII.2008.922444

Egels M., J. Gaubert, P. Pannier, S. Bourdel. A 52 GHz, 8.5 dB traveling wave amplifier in 0.13 µm standard CMOS process. IEEE Trans. on Microwaves Theory and Techniques, vol. 56,  5 Part 2,  p. 1226 - 1233, 2008 http://dx.doi.org/10.1109/TMTT.2008.920169

Conférence invitee

P. Pannier, T. Deleruyelle, E. Bergeret : " Les économies d'énergie au cœur des systèmes RFID. ", Première édition d’ICTF, International Contactless Technologies Forum, Lille 2008.

Conférences internationales

T. Deleruyelle, P. Pannier, S. Bourdel, "Multi-Standard Slot Antenna in 860-960 MHz and2.45 GHz RFID Band.",  International Symposium of Antennas and Propagation Society ; AP-S 2008,  pp 1 – 4, San-Diego, 5-11 Juilly 2008 - Digital Object Identifier 10.1109/APS.2008.4619588

J.R Cubillo, J. Gaubert, S. Bourdel, "Using die to chip carrier wire bond transition to build a 4^th order differential LP filter for 10GBps O/E receiver", 12th IEEE WORKSHOP ON SIGNAL PROPAGATION ON INTERCONNECTS, May 12-15, 2008, Avignon, France, pp 1-4.

E. Bergeret, T. Deleruyelle, Ph. Pannier, J. Gaubert, "UHF RFID Tag Robustness", XXIX General Assembly of the International Union of Radio Science, URSI08, Chicago, Illinois, USA, August 07-16, 2008.

T. Deleruyelle, P. Pannier, E. Bergeret, S. Bourdel, "Dual Band UHF and Microwave RFID Antenna.", 38th European  Microwave Conference, EuMC 2008, pp 1763-1766, Amsterdam, Octobre 2008 - Digital Object Identifier 10.1109/EUMC.2008.4751818 

T. Deleruyelle, P. Pannier, E. Bergeret, S. Bourdel ,"Dual Band UHF and Microwave RFID Antenna.", Wireless Technology, 2008. EuWiT 2008, Europe Conference on, pp 342-345 ; 27,28 Octobre 2008.

Cubillo, J.R.; Gaubert, J.; Bourdel, S., "Optimizing CPW to MSL transition in the mm domain thanks to the LP filter theory", Electronics System integration Technology Conference, 2008. ESTC 2008. 2nd, 1-4 Sept. 2008 Page(s): 531 – 534. Digital Object Identifier 10.1109/ESTC.2008.4684405

O. Fourquin, J.R. Cubillo, J. Gaubert, S.Bourdel, M. Battista, "Enhanced Wire Bond Transition from Die to Chip Carrier for 3.1-10.6 GHz UWB applications", IEEE Electrical Design of Advanced Packaging and Systems EDAPS symposium 2008, Seoul, South Korea, Dec 2008, pp 218-221. Digital Object Identifier 10.1109/EDAPS.2008.4736039